US8059384B2 - Printed circuit board reinforcement structure and integrated circuit package using the same - Google Patents

Printed circuit board reinforcement structure and integrated circuit package using the same Download PDF

Info

Publication number
US8059384B2
US8059384B2 US12/183,463 US18346308A US8059384B2 US 8059384 B2 US8059384 B2 US 8059384B2 US 18346308 A US18346308 A US 18346308A US 8059384 B2 US8059384 B2 US 8059384B2
Authority
US
United States
Prior art keywords
circuit board
printed circuit
surface mounting
layer
soft layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related, expires
Application number
US12/183,463
Other versions
US20090032292A1 (en
Inventor
Se Ho Park
Young-Min Lee
Ki-Hyun Kim
Seok-Myong Kang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KANG, SEOK-MYONG, KIM, KI-HYUN, LEE, YOUNG-MIN, PARK, SE-HO
Publication of US20090032292A1 publication Critical patent/US20090032292A1/en
Application granted granted Critical
Publication of US8059384B2 publication Critical patent/US8059384B2/en
Expired - Fee Related legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Definitions

  • the present invention relates to an IC (Integrated Circuit) package, and in particular to a PCB (Printed Circuit Board) reinforcement structure for preventing the deformation of and damage to a thin printed circuit board (for example, a printed circuit board having a thickness of not more than 0.4 mm), and an integrated circuit package using the same.
  • IC Integrated Circuit
  • PCB Printed Circuit Board
  • a printed circuit board serves to mechanically fix electronic parts mounted thereon, beyond electrically interconnecting the electronic parts. Therefore, such a printed circuit board should maintain mechanical strength to such an extent that it is not deformed or damaged during a fabrication process of electronic appliances or a packaging process of the printed circuit board.
  • the practical lower limit for printed circuit board thickness has been limited to about 1.0 mm up to now.
  • the conventional method for overcoming the limitation in thickness of a printed circuit board is to reinforce a printed circuit board material with filler, such as glass fiber, so as to increase the rigidity of the printed circuit board.
  • this conventional method induces a quality problem, such as the deterioration of molding workability, and a difficult recycling problem due to the use of a material harmful for human body and environment.
  • Another conventional method for increasing the strength of a printed circuit board is to spray resin on a printed circuit board, on which a surface mounting device processing is completed, and then curing the resin.
  • the length of time required for spraying the resin is long.
  • the present invention has been made to solve the above-mentioned problems occurring in the prior art, and the present invention provides a printed circuit board reinforcement structure which does not increase the thickness of a printed circuit board, and is capable of maintaining structural rigidity (mechanical strength) of the printed circuit board, without substantially changing the material and design of a printed circuit board, and to provide an integrated circuit package using such a printed circuit board reinforcement structure.
  • the present invention provides an integrated circuit package, wherein the method employs a printed circuit board having a thickness of not more than 1.0 mm, so that the thickness of the integrated circuit package can be reduced, and the strength of the printed circuit board can be increased.
  • a printed circuit board reinforcement structure for reinforcing the rigidity of a printed circuit board with a plurality of surface mounting devices, including a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness, so that the openings can receive the corresponding surface mounting devices among the surface mounting devices mounted on the printed circuit board, respectively; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices.
  • the hard layer may include, in combination, one or more materials selected from a group including an EMC (Epoxy Mold Compound); an engineering plastic including PES (Poly Ethylene Sulpone) and PC (Poly Carbonate); a composite material including FRP (Glass Fiber Reinforced Plastic), GRP (Graphite Reinforced Plastic), basalt or ceramic; and a metallic material including steel, stainless steel, aluminum, magnesium and alloys thereof.
  • EMC Epoxy Mold Compound
  • PES Poly Ethylene Sulpone
  • PC Poly Carbonate
  • FRP Glass Fiber Reinforced Plastic
  • GRP Graphite Reinforced Plastic
  • basalt or ceramic a metallic material including steel, stainless steel, aluminum, magnesium and alloys thereof.
  • the flexural strength of the hard layer is not less than 100 MPa at a temperature in the range of ⁇ 40 to 85° C.
  • the soft layer may include, in combination, one or more materials selected from a group including rubber with a visco-elastic characteristic; a PSA (Pressure Sensitive Adhesive) or EVA (Ethylene Vinyl Alcohol); hot-melt having a characteristic being softened at a temperature in the range of 60 to 160° C.; and resin or gel having viscosity not less than 1000 cps.
  • a PSA Pressure Sensitive Adhesive
  • EVA Ethylene Vinyl Alcohol
  • hot-melt having a characteristic being softened at a temperature in the range of 60 to 160° C.
  • resin or gel having viscosity not less than 1000 cps.
  • the thickness of the soft layer is greater than or equal to that of the lowest surface mounting device among the surface mounting devices, and the opposite sides of the soft layer have different adhesive forces.
  • the top and bottom sides of the soft layer have different adhesive forces, and the adhesive force of the top side of the soft layer is greater than that of the bottom side thereof.
  • the adhesive force of the bottom side of the soft layer is in the range of 1 to 10 N/cm at a temperature in the range of ⁇ 40 to 85° C.
  • the printed circuit board reinforcement structure may further include an adhesive layer formed between the hard layer and the soft layer.
  • the adhesive layer may include, in combination, one or more materials selected from a group including epoxy (BPA); a thermoplastic material including EVA (Ethylene Vinyl Alcohol); and a PAS (Pressure Sensitive Adhesive).
  • the printed circuit board reinforcement structure may further include a hydrophobic sealing layer formed along the circumferential edge of the soft layer.
  • an integrated circuit package including a printed circuit board with a plurality of surface mounting devices; a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness, so that the openings can receive the corresponding surface mounting devices among the surface mounting devices mounted on the printed circuit board, respectively; and a soft layer bonded to a side of the hard layer so that the soft layer can acconmmodate the protrusion of the surface mounting devices.
  • FIG. 1 is a schematic perspective view for illustrating a construction of a printed circuit board reinforcement structure according to an embodiment of the present invention.
  • FIG. 2A is a schematic cross-sectional exploding view for illustrating an application of the printed circuit board reinforcement structure according to an embodiment of the present invention.
  • FIG. 2B is a schematic cross-sectional assembled view for illustrating an application of the printed circuit board reinforcement structure according to an embodiment of the present invention.
  • FIG. 1 is a schematic perspective view for illustrating a construction of a printed circuit board reinforcement structure according to an embodiment of the present invention.
  • the printed circuit board reinforcement structure is depicted together with a printed circuit board 10 , on which a plurality of SMDs (Surface Mounting Devices) is mounted.
  • SMDs Surface Mounting Devices
  • the printed circuit board reinforcement structure 100 includes a hard layer 110 and a soft layer 120 , wherein the hard layer 110 and the soft layer 120 are adhered to each other on the opposed sides 110 A and 120 B.
  • the hard layer 110 has a bending modulus preferably of 100 MPa at a temperature in the range of ⁇ 40 to 85° C., and a volumetric thermal coefficient of not more than 100E-6/K at a temperature in the range of ⁇ 40 to 85° C., so that the hard layer 110 can maintain structural rigidity with high strength.
  • the material of the hard layer 110 should be sufficiently thermally stable (higher than 160° C.), thermally conductive, humidity-resistant (absorption rate of not higher than 1%), and weather-resistant.
  • materials satisfying the above requirements include engineering plastics, such as EMC (Epoxy Mold Compound), PES (Poly Ethylene Sulpone), PPO (Poly Penylene Oxide), and PC (Poly Carbonate), and metallic materials, such as steel, stainless steel, aluminum, magnesium, and alloy.
  • EMC Epoxy Mold Compound
  • PES Poly Ethylene Sulpone
  • PPO Poly Penylene Oxide
  • PC PC Carbonate
  • metallic materials such as steel, stainless steel, aluminum, magnesium, and alloy.
  • Each of the hard layer 110 and the soft layer 120 includes a plurality of openings at areas corresponding to thick surface mounting devices 11 , 12 and 13 (the thicknesses of the surface mounting devices may exceed the thickness of the soft layer), so that the surface mounting devices 11 , 12 and 13 can be received in the openings, respectively.
  • each of the openings 111 , 112 and 113 has the same horizontal cross-sectional shape as corresponding one of the surface mounting devices 11 , 12 and 13 , and has a size larger than that of the corresponding surface mounting device.
  • the hard layer 110 is formed with a plurality of holes (for example, pin-holes 119 ), wherein the holes are spaced from each other so as to dissipate pressure applied to the soft layer when the hard layer 110 and the top surfaces of the surface mounting devices excessively approach each other.
  • the soft layer 120 serves to accommodate the protrusion of a plurality of surface mounting devices mounted on the printed circuit board 10 and having different heights.
  • the soft layer 120 preferably accommodates the protrusion of thin surface mounting devices 14 , 15 , 16 , 17 and 18 .
  • the soft layer 120 may be formed from rubber and PSA (Pressure Sensitive Adhesive) having a visco-elastic characteristic, or resin or gel having high viscosity. Hot-melt resin having a characteristic softened at a temperature in the range of 100° C. to 160° C. may also be employed for forming the soft layer 120 .
  • PSA Pressure Sensitive Adhesive
  • the material of the soft layer 120 should be sufficiently thermally stable (higher than 160° C.), thermally conductive, humidity-resistant (absorption rate of not higher than 1%), and weather-resistant.
  • the soft layer 120 has a bending modulus preferably of 100 MPa at a temperature in the range of ⁇ 40 to 85° C., and a volumetric thermal coefficient of not more than 100E-6/K at a temperature in the range of ⁇ 40 to 85° C., so that the hard layer 110 can maintain structural rigidity with high strength.
  • One side (the bottom side 120 A) of the soft layer is coated with or film-laminated with adhesive so as to bond the soft layer to the printed circuit board 10 on which the surface mounting devices 11 to 18 are mounted.
  • the adhesive maintains its adhesive force in the range of 1 to 10 N/cm at a temperature in the range of ⁇ 40 to 85° C.
  • the other side (the top side 120 B) is bonded to one side (the bottom side 110 A) of the hard layer.
  • the bonding force between the soft layer and the hard layer is made to be equal to or higher than the bonding force between the soft layer and the printed circuit board, in order to make the residue of the soft layer not retained on the printed circuit board when the reinforcement structure 100 is separated from the printed circuit board.
  • a thermoplastic resin including Epoxy (BPA), and EVA (Ethylene Vinyl Alcohol), or a PSA (Pressure Sensitive Adhesive) may be employed as the adhesive.
  • FIGS. 2A and 2B are schematic cross-sectional views for illustrating an application of the printed circuit board reinforcement structure according to an embodiment of the present invention, wherein FIG. 2A shows a state prior to bonding the super-thin printed circuit board 20 , on the top of which a plurality of devices (electronic parts) with different heights is mounted, to the reinforcement structure, and FIG. 2B shows a state after to bonding the super-thin printed circuit board 20 to the reinforcement structure 200 .
  • the present embodiment shows an example of the application of the present invention, in which the thickness of the super-thin printed circuit board 20 is about 0.4 mm, and the thicknesses (heights) of the devices (electronic parts) mounted on the top of the printed circuit board 20 are 1.4 mm (the device 21 ), 1.0 mm (the device 22 ), 0.4 mm (the device 23 ), and 0.6 mm (the device 24 ).
  • the fabrication and application processes of the printed circuit board reinforcement structure will be described with reference to the present embodiment.
  • the hard layer 210 is firstly fabricated with a thickness of about 0.4 mm through extrusion, roll press, or injection molding. If any of the devices mounted on the printed circuit board 20 has a thickness greater than the predetermined thickness (0.8 mm) of the soft layer, areas corresponding to such devices are formed with openings 221 and 222 . If the hard layer 210 is fabricated through extrusion or roll press, the openings 221 and 222 can be formed through press or punch trim. If the hard layer 210 is fabricated through injection molding, it is possible to render the openings formed in the injection molding process through the design of a mold for the injection molding.
  • the soft layer 220 with a thickness of 0.8 mm is bonded to the bottom side 210 A of the hard layer.
  • the soft layer 220 may be formed through coating or film-laminating with a soft material capable of maintaining a predetermined shape. Theoretically, the thickness of the soft layer 220 should be equal to or greater than the thickness of the thinnest part(s) among the parts mounted on the printed circuit board. Practically, the thickness of the soft layer 220 is preferably not less than 0.3 mm.
  • the adhesive force between the soft layer 220 and the hard layer 210 is good due to the physical properties thereof, it is possible to omit the process of applying the adhesive.
  • adhesive is applied to the bottom side 220 A of the soft layer through coating or film-laminating, thereby completing the printed circuit board reinforcement structure 200 .
  • the completed printed circuit board reinforcement structure 200 is aligned above the printed circuit board 20 , on which the surface mounting devices 21 to 24 are mounted, and then pressed with a proper level of pressure (for example, not higher than 150 MPa), so that the printed circuit board reinforcement structure 200 and the printed circuit board 20 are tightly bonded to each other.
  • a proper level of pressure for example, not higher than 150 MPa
  • the soft layer 220 is introduced into and fills spaces formed between the devices mounted on the printed circuit board 20 .
  • the temperature does not exceed 160° C.
  • the present invention it is possible to prevent the occurrence of defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board having a thickness for example, about 0.4 mm, thereby reinforcing the rigidity (mechanical strength) of the printed circuit board.
  • the entire assembling process is very simplified because it is not necessary to make a mold or a diaphragm to come into close contact with a printed circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board.

Description

PRIORITY
This application claims the priority under 35 U.S.C. §119(a) to an application filed in the Korean Industrial Property Office on Jul. 31, 2007 and assigned Serial No. 2007-77047, the contents of which are hereby incorporated by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an IC (Integrated Circuit) package, and in particular to a PCB (Printed Circuit Board) reinforcement structure for preventing the deformation of and damage to a thin printed circuit board (for example, a printed circuit board having a thickness of not more than 0.4 mm), and an integrated circuit package using the same.
2. Description of the Related Art
Recently, due to the miniaturization, thinning, and weight reduction of electronic appliances, highly integrated circuit packages are required. For this reason, the super-thin design of printed circuit boards is also required.
A printed circuit board serves to mechanically fix electronic parts mounted thereon, beyond electrically interconnecting the electronic parts. Therefore, such a printed circuit board should maintain mechanical strength to such an extent that it is not deformed or damaged during a fabrication process of electronic appliances or a packaging process of the printed circuit board.
In general, however, if the thickness of a printed circuit board is reduced, the rigidity (mechanical strength) of the printed circuit board is also reduced, whereby the printed circuit board is subjected to deformation, such as flexure, distortion, etc., and its reliability is deteriorated. Therefore, the practical lower limit for printed circuit board thickness has been limited to about 1.0 mm up to now.
The conventional method for overcoming the limitation in thickness of a printed circuit board is to reinforce a printed circuit board material with filler, such as glass fiber, so as to increase the rigidity of the printed circuit board. However, this conventional method induces a quality problem, such as the deterioration of molding workability, and a difficult recycling problem due to the use of a material harmful for human body and environment.
There is another conventional method for increasing the strength of the printed circuit board by introducing resin between a printed circuit board, on which a SMD (Surface Mounting Device) process is completed, and a mold, and then curing the resin. However, according to this method, the processes for making the mold come into close contact with the printed circuit board, and introducing the resin are very complicated. In addition, since resin residue remains in a gap between the printed circuit board and the mold, a post process for smoothing the surfaces of the printed circuit board is required. Consequently, this method is not suitable for mass production. Specifically, there is a disadvantage in that the resin contracts while it is being cured, thereby rendering the printed circuit board warped.
Another conventional method for increasing the strength of a printed circuit board is to spray resin on a printed circuit board, on which a surface mounting device processing is completed, and then curing the resin. However, the length of time required for spraying the resin is long. In addition, it is necessary to separately block one or more areas, to which the resin shall not be applied. Consequently, this method is also not suitable for mass production.
SUMMARY OF THE INVENTION
Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and the present invention provides a printed circuit board reinforcement structure which does not increase the thickness of a printed circuit board, and is capable of maintaining structural rigidity (mechanical strength) of the printed circuit board, without substantially changing the material and design of a printed circuit board, and to provide an integrated circuit package using such a printed circuit board reinforcement structure.
In addition, the present invention provides an integrated circuit package, wherein the method employs a printed circuit board having a thickness of not more than 1.0 mm, so that the thickness of the integrated circuit package can be reduced, and the strength of the printed circuit board can be increased.
According to an aspect of the present invention, there is provided a printed circuit board reinforcement structure for reinforcing the rigidity of a printed circuit board with a plurality of surface mounting devices, including a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness, so that the openings can receive the corresponding surface mounting devices among the surface mounting devices mounted on the printed circuit board, respectively; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices.
The hard layer may include, in combination, one or more materials selected from a group including an EMC (Epoxy Mold Compound); an engineering plastic including PES (Poly Ethylene Sulpone) and PC (Poly Carbonate); a composite material including FRP (Glass Fiber Reinforced Plastic), GRP (Graphite Reinforced Plastic), basalt or ceramic; and a metallic material including steel, stainless steel, aluminum, magnesium and alloys thereof.
Preferably, the flexural strength of the hard layer is not less than 100 MPa at a temperature in the range of −40 to 85° C.
The soft layer may include, in combination, one or more materials selected from a group including rubber with a visco-elastic characteristic; a PSA (Pressure Sensitive Adhesive) or EVA (Ethylene Vinyl Alcohol); hot-melt having a characteristic being softened at a temperature in the range of 60 to 160° C.; and resin or gel having viscosity not less than 1000 cps.
The thickness of the soft layer is greater than or equal to that of the lowest surface mounting device among the surface mounting devices, and the opposite sides of the soft layer have different adhesive forces.
The top and bottom sides of the soft layer have different adhesive forces, and the adhesive force of the top side of the soft layer is greater than that of the bottom side thereof. Preferably, the adhesive force of the bottom side of the soft layer is in the range of 1 to 10 N/cm at a temperature in the range of −40 to 85° C.
The printed circuit board reinforcement structure may further include an adhesive layer formed between the hard layer and the soft layer. The adhesive layer may include, in combination, one or more materials selected from a group including epoxy (BPA); a thermoplastic material including EVA (Ethylene Vinyl Alcohol); and a PAS (Pressure Sensitive Adhesive).
The printed circuit board reinforcement structure may further include a hydrophobic sealing layer formed along the circumferential edge of the soft layer.
According to another aspect of the present invention, there is a provided an integrated circuit package including a printed circuit board with a plurality of surface mounting devices; a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness, so that the openings can receive the corresponding surface mounting devices among the surface mounting devices mounted on the printed circuit board, respectively; and a soft layer bonded to a side of the hard layer so that the soft layer can acconmmodate the protrusion of the surface mounting devices.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic perspective view for illustrating a construction of a printed circuit board reinforcement structure according to an embodiment of the present invention; and
FIG. 2A is a schematic cross-sectional exploding view for illustrating an application of the printed circuit board reinforcement structure according to an embodiment of the present invention.
FIG. 2B is a schematic cross-sectional assembled view for illustrating an application of the printed circuit board reinforcement structure according to an embodiment of the present invention.
 DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS
Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that in the following description, the same elements will be designated by the same reference numerals even though they are shown in different drawings. In addition, in the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted for clarity and conciseness.
FIG. 1 is a schematic perspective view for illustrating a construction of a printed circuit board reinforcement structure according to an embodiment of the present invention. For the convenience of description, the printed circuit board reinforcement structure is depicted together with a printed circuit board 10, on which a plurality of SMDs (Surface Mounting Devices) is mounted.
Referring to FIG. 1, the printed circuit board reinforcement structure 100 includes a hard layer 110 and a soft layer 120, wherein the hard layer 110 and the soft layer 120 are adhered to each other on the opposed sides 110A and 120B.
Preferably, the hard layer 110 has a bending modulus preferably of 100 MPa at a temperature in the range of −40 to 85° C., and a volumetric thermal coefficient of not more than 100E-6/K at a temperature in the range of −40 to 85° C., so that the hard layer 110 can maintain structural rigidity with high strength. In addition, the material of the hard layer 110 should be sufficiently thermally stable (higher than 160° C.), thermally conductive, humidity-resistant (absorption rate of not higher than 1%), and weather-resistant.
The examples of materials satisfying the above requirements include engineering plastics, such as EMC (Epoxy Mold Compound), PES (Poly Ethylene Sulpone), PPO (Poly Penylene Oxide), and PC (Poly Carbonate), and metallic materials, such as steel, stainless steel, aluminum, magnesium, and alloy.
Each of the hard layer 110 and the soft layer 120 includes a plurality of openings at areas corresponding to thick surface mounting devices 11, 12 and 13 (the thicknesses of the surface mounting devices may exceed the thickness of the soft layer), so that the surface mounting devices 11, 12 and 13 can be received in the openings, respectively. Preferably, each of the openings 111, 112 and 113 has the same horizontal cross-sectional shape as corresponding one of the surface mounting devices 11, 12 and 13, and has a size larger than that of the corresponding surface mounting device.
In addition, the hard layer 110 is formed with a plurality of holes (for example, pin-holes 119), wherein the holes are spaced from each other so as to dissipate pressure applied to the soft layer when the hard layer 110 and the top surfaces of the surface mounting devices excessively approach each other.
One side 120B of the soft layer 120 is attached to one side 110A of the hard layer 110, wherein the soft layer 120 serves to accommodate the protrusion of a plurality of surface mounting devices mounted on the printed circuit board 10 and having different heights. Specifically, the soft layer 120 preferably accommodates the protrusion of thin surface mounting devices 14, 15, 16, 17 and 18. For this purpose, the soft layer 120 may be formed from rubber and PSA (Pressure Sensitive Adhesive) having a visco-elastic characteristic, or resin or gel having high viscosity. Hot-melt resin having a characteristic softened at a temperature in the range of 100° C. to 160° C. may also be employed for forming the soft layer 120.
Like the material of the hard layer 110, it is preferable that the material of the soft layer 120 should be sufficiently thermally stable (higher than 160° C.), thermally conductive, humidity-resistant (absorption rate of not higher than 1%), and weather-resistant. Preferably, the soft layer 120 has a bending modulus preferably of 100 MPa at a temperature in the range of −40 to 85° C., and a volumetric thermal coefficient of not more than 100E-6/K at a temperature in the range of −40 to 85° C., so that the hard layer 110 can maintain structural rigidity with high strength.
One side (the bottom side 120A) of the soft layer is coated with or film-laminated with adhesive so as to bond the soft layer to the printed circuit board 10 on which the surface mounting devices 11 to 18 are mounted. Preferably, the adhesive maintains its adhesive force in the range of 1 to 10 N/cm at a temperature in the range of −40 to 85° C.
The other side (the top side 120B) is bonded to one side (the bottom side 110A) of the hard layer. In this event, the bonding force between the soft layer and the hard layer is made to be equal to or higher than the bonding force between the soft layer and the printed circuit board, in order to make the residue of the soft layer not retained on the printed circuit board when the reinforcement structure 100 is separated from the printed circuit board. For example, a thermoplastic resin including Epoxy (BPA), and EVA (Ethylene Vinyl Alcohol), or a PSA (Pressure Sensitive Adhesive) may be employed as the adhesive.
In addition, by sealing the circumferential edge of the soft layer with a hydrophobic material, it is possible to prevent moisture from penetrating into the interface between the soft layer and the printed circuit board.
FIGS. 2A and 2B are schematic cross-sectional views for illustrating an application of the printed circuit board reinforcement structure according to an embodiment of the present invention, wherein FIG. 2A shows a state prior to bonding the super-thin printed circuit board 20, on the top of which a plurality of devices (electronic parts) with different heights is mounted, to the reinforcement structure, and FIG. 2B shows a state after to bonding the super-thin printed circuit board 20 to the reinforcement structure 200. The present embodiment shows an example of the application of the present invention, in which the thickness of the super-thin printed circuit board 20 is about 0.4 mm, and the thicknesses (heights) of the devices (electronic parts) mounted on the top of the printed circuit board 20 are 1.4 mm (the device 21), 1.0 mm (the device 22), 0.4 mm (the device 23), and 0.6 mm (the device 24). Now, the fabrication and application processes of the printed circuit board reinforcement structure will be described with reference to the present embodiment.
Referring to FIG. 2A, the hard layer 210 is firstly fabricated with a thickness of about 0.4 mm through extrusion, roll press, or injection molding. If any of the devices mounted on the printed circuit board 20 has a thickness greater than the predetermined thickness (0.8 mm) of the soft layer, areas corresponding to such devices are formed with openings 221 and 222. If the hard layer 210 is fabricated through extrusion or roll press, the openings 221 and 222 can be formed through press or punch trim. If the hard layer 210 is fabricated through injection molding, it is possible to render the openings formed in the injection molding process through the design of a mold for the injection molding.
Next, adhesive is applied to one side (the bottom side 210A) of the hard layer 210 through coating or film-laminating, and then the soft layer 220 with a thickness of 0.8 mm is bonded to the bottom side 210A of the hard layer. The soft layer 220 may be formed through coating or film-laminating with a soft material capable of maintaining a predetermined shape. Theoretically, the thickness of the soft layer 220 should be equal to or greater than the thickness of the thinnest part(s) among the parts mounted on the printed circuit board. Practically, the thickness of the soft layer 220 is preferably not less than 0.3 mm. If the adhesive force between the soft layer 220 and the hard layer 210 is good due to the physical properties thereof, it is possible to omit the process of applying the adhesive. In addition, in order to suppress the penetration of moisture into the interface of the soft layer 220 and the printed circuit board 20 when the reinforcement structure is bonded to the printed circuit board 20, it is possible to seal the circumferential edge of the soft layer 20 with a hydrophobic material.
Next, adhesive is applied to the bottom side 220A of the soft layer through coating or film-laminating, thereby completing the printed circuit board reinforcement structure 200.
Referring to FIG. 2B, the completed printed circuit board reinforcement structure 200 is aligned above the printed circuit board 20, on which the surface mounting devices 21 to 24 are mounted, and then pressed with a proper level of pressure (for example, not higher than 150 MPa), so that the printed circuit board reinforcement structure 200 and the printed circuit board 20 are tightly bonded to each other. At this time, the soft layer 220 is introduced into and fills spaces formed between the devices mounted on the printed circuit board 20. In order to reduce the viscosity of the soft layer and to increase the adhesiveness of the soft layer, it is possible to increase the temperature. However, in order to prevent the damage of the devices, it is preferable if the temperature does not exceed 160° C.
Although specific embodiments are described herein, it is possible to variously modify the embodiments without departing from the scope of the present invention. For example, the materials and the thicknesses of the hard layer and the soft layer, the sizes of the openings, etc. can be properly selected or designed as needed.
According to the present invention, it is possible to prevent the occurrence of defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board having a thickness for example, about 0.4 mm, thereby reinforcing the rigidity (mechanical strength) of the printed circuit board.
In addition, according to the present invention, the entire assembling process is very simplified because it is not necessary to make a mold or a diaphragm to come into close contact with a printed circuit board.
While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (17)

1. A printed circuit board reinforcement structure for reinforcing rigidity of a printed circuit board receiving a plurality of surface mounting devices, comprising:
a hard layer and a soft layer, each having at least one opening formed at an area corresponding to at least one thick surface mounting device among the surface mounting devices, the at least one thick surface mounting device having a thickness exceeding a predetermined thickness,
wherein the soft layer is bonded to a side of the hard layer so that the soft layer can accommodate protrusion of thin surface mounting devices among the surface mounting devices, the thin surface mounting devices being thinner than the predetermined thickness.
2. The printed circuit board reinforcement structure as claimed in claim 1, wherein the hard layer comprises at least one of:
an EMC (Epoxy Mold Compound);
an engineering plastic including PES (Poly Ethylene Sulpone) and PC (Poly Carbonate);
a composite material including FRP (Glass Fiber Reinforced Plastic), GRP (Graphite Reinforced Plastic), Basult or ceramic; and
a metallic material including steel, stainless steel, aluminum, magnesium and alloys thereof.
3. The printed circuit board reinforcement structure as claimed in claim 1, wherein the flexural strength of the hard layer is not less than 100 MPa at a temperature in the range of −40 to 85° C.
4. The printed circuit board reinforcement structure as claimed in claim 1, wherein the hard layer further comprises a plurality of holes formed through the hard layer.
5. The printed circuit board reinforcement structure as claimed in claim 1, wherein the soft layer comprises at least one of:
rubber with a visco-elastic characteristic;
a PSA (Pressure Sensitive Adhesive) or EVA (Ethylene Vinyl Alcohol);
hot-melt having a characteristic being softened at a temperature in the range of 60 to 160° C.; and
resin or gel having viscosity of not less than 1000 cps.
6. The printed circuit board reinforcement structure as claimed in claim 1, wherein the thickness of the soft layer is greater than or equal to that of the thinnest surface mounting device among the thin surface mounting devices.
7. The printed circuit board reinforcement structure as claimed in claim 1, wherein top adhesive force of the top side of the soft layer is greater than bottom adhesive force of the bottom side thereof.
8. The printed circuit board reinforcement structure as claimed in claim 7, wherein the bottom adhesive force is in the range of 1 to 10 N/cm at a temperature in a temperature range of −40 to 85° C.
9. The printed circuit board reinforcement structure as claimed in claim 1, further comprising an adhesive layer formed between the hard layer and the soft layer.
10. The printed circuit board reinforcement structure as claimed in claim 9, wherein the adhesive layer comprises at least one of:
epoxy (BPA);
a thermoplastic material including EVA (Ethylene Vinyl Alcohol); and
a PAS (Pressure Sensitive Adhesive).
11. The printed circuit board reinforcement structure as claimed in claim 1, further comprising a hydrophobic sealing layer formed along the circumferential edge of the soft layer.
12. An integrated circuit package comprising:
a printed circuit board receiving a plurality of surface mounting devices; and
a hard layer and a soft layer each having at least one opening formed at an area corresponding to at least one thick surface mounting device among the surface mounting devices, the at least one thick surface mounting device having a thickness exceeding a predetermined thickness,
wherein the soft layer is bonded between the hard layer and the printed circuit board so that the soft layer can accommodate protrusion of thin surface mounting devices among the surface mounting devices, the thin surface mounting devices being thinner than the predetermined thickness.
13. The integrated circuit package as claimed in claim 12, further comprising a plurality of holes formed through the hard layer.
14. The integrated circuit package as claimed in claim 12, wherein the thickness of the soft layer is greater than or equal to that of the thinnest surface mounting device among the thin surface mounting devices.
15. The integrated circuit package as claimed in claim 12, wherein top adhesive force between the soft layer and the hard layer is greater than bottom adhesive force between the soft layer and the printed circuit board.
16. The integrated circuit package as claimed in claim 12, further comprising an adhesive layer formed between the hard layer and the soft layer.
17. The integrated circuit package as claimed in claim 12, further comprising a hydrophobic sealing layer formed along the circumferential edge of the soft layer.
US12/183,463 2007-07-31 2008-07-31 Printed circuit board reinforcement structure and integrated circuit package using the same Expired - Fee Related US8059384B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2007-0077047 2007-07-31
KRP2007-0077047 2007-07-31
KR1020070077047A KR101354372B1 (en) 2007-07-31 2007-07-31 Reinforce for printed circuit board and integrated circuit package using the same

Publications (2)

Publication Number Publication Date
US20090032292A1 US20090032292A1 (en) 2009-02-05
US8059384B2 true US8059384B2 (en) 2011-11-15

Family

ID=40337068

Family Applications (1)

Application Number Title Priority Date Filing Date
US12/183,463 Expired - Fee Related US8059384B2 (en) 2007-07-31 2008-07-31 Printed circuit board reinforcement structure and integrated circuit package using the same

Country Status (2)

Country Link
US (1) US8059384B2 (en)
KR (1) KR101354372B1 (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130227836A1 (en) * 2012-03-02 2013-09-05 David Otto Whitt, III Input device manufacture
US8949477B2 (en) 2012-05-14 2015-02-03 Microsoft Technology Licensing, Llc Accessory device architecture
US8947864B2 (en) 2012-03-02 2015-02-03 Microsoft Corporation Flexible hinge and removable attachment
US8991473B2 (en) 2012-10-17 2015-03-31 Microsoft Technology Holding, LLC Metal alloy injection molding protrusions
US9027631B2 (en) 2012-10-17 2015-05-12 Microsoft Technology Licensing, Llc Metal alloy injection molding overflows
US9075566B2 (en) 2012-03-02 2015-07-07 Microsoft Technoogy Licensing, LLC Flexible hinge spine
US9073123B2 (en) 2012-06-13 2015-07-07 Microsoft Technology Licensing, Llc Housing vents
US9298236B2 (en) 2012-03-02 2016-03-29 Microsoft Technology Licensing, Llc Multi-stage power adapter configured to provide a first power level upon initial connection of the power adapter to the host device and a second power level thereafter upon notification from the host device to the power adapter
US9304549B2 (en) 2013-03-28 2016-04-05 Microsoft Technology Licensing, Llc Hinge mechanism for rotatable component attachment
US9360893B2 (en) 2012-03-02 2016-06-07 Microsoft Technology Licensing, Llc Input device writing surface
US9426905B2 (en) 2012-03-02 2016-08-23 Microsoft Technology Licensing, Llc Connection device for computing devices
US9432070B2 (en) 2012-10-16 2016-08-30 Microsoft Technology Licensing, Llc Antenna placement
TWI566652B (en) * 2015-09-16 2017-01-11 臻鼎科技股份有限公司 Circuit board and method for making the same field
US9661770B2 (en) 2012-10-17 2017-05-23 Microsoft Technology Licensing, Llc Graphic formation via material ablation
US9824808B2 (en) 2012-08-20 2017-11-21 Microsoft Technology Licensing, Llc Switchable magnetic lock
US9870066B2 (en) 2012-03-02 2018-01-16 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US10031556B2 (en) 2012-06-08 2018-07-24 Microsoft Technology Licensing, Llc User experience adaptation
US10101773B2 (en) 2016-04-08 2018-10-16 Microsoft Technology Licensing, Llc Non-woven material device covering
US10107994B2 (en) 2012-06-12 2018-10-23 Microsoft Technology Licensing, Llc Wide field-of-view virtual image projector
US10156889B2 (en) 2014-09-15 2018-12-18 Microsoft Technology Licensing, Llc Inductive peripheral retention device
USRE48963E1 (en) 2012-03-02 2022-03-08 Microsoft Technology Licensing, Llc Connection device for computing devices

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US9317079B2 (en) * 2011-03-29 2016-04-19 Echostar Uk Holdings Limited Media content device with customized panel
FR2976761B1 (en) * 2011-06-17 2014-05-02 Commissariat Energie Atomique PRINTED CIRCUIT FOR INTERCONNECTING AND MEASURING BATTERY BATTERY ACCUMULATORS
KR20150013439A (en) * 2012-05-15 2015-02-05 마이크로소프트 코포레이션 Input device manufacture
US9546763B2 (en) * 2014-07-25 2017-01-17 Graftech International Holdings Inc. Flexible circuit board with graphite substrate and circuit arrangements using same
US20170245367A1 (en) * 2016-02-22 2017-08-24 Raytheon Company Circuit card assembly (cca) with reduced susceptibility to deform under loading
KR102659093B1 (en) * 2018-03-08 2024-04-22 삼성전자주식회사 Circuit board including conductive structures electrically connecting lines and electronic device including the same
CN108538737B (en) * 2018-03-22 2019-12-24 江西芯创光电有限公司 Pressing method of carrier plate

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5574309A (en) * 1991-11-25 1996-11-12 Gemplus Card International Integrated circuit card comprising means for the protection of the integrated circuit
US5822194A (en) * 1994-03-31 1998-10-13 Ibiden Co., Ltd. Electronic part mounting device
WO2002034856A1 (en) 2000-10-27 2002-05-02 Seong Il Chemical Co., Ltd. Hot-melt adhesive for electronic components
US6506626B1 (en) * 2000-05-12 2003-01-14 Siliconware Precision Industries Co., Ltd. Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US7038142B2 (en) * 2002-01-24 2006-05-02 Fujitsu Limited Circuit board and method for fabricating the same, and electronic device
US20060139902A1 (en) * 2004-12-28 2006-06-29 Kabushiki Kaisha Toshiba Double-sided component-mounted circuit board and method for manufacturing the same
US20060171130A1 (en) * 2002-12-27 2006-08-03 Renesas Technology Corp. Semiconductor module
US20070044303A1 (en) * 2005-08-26 2007-03-01 Shinko Electric Industries Co., Ltd. Method of manufacturing wiring board
US20090107715A1 (en) * 2006-05-24 2009-04-30 Dai Nippon Printing Co. Ltd. Wiring board with a built-in component and method for manufacturing the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100607626B1 (en) 2004-05-25 2006-08-01 대덕전자 주식회사 Flat coating method using resin coated copper foil in printed circuit board

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5574309A (en) * 1991-11-25 1996-11-12 Gemplus Card International Integrated circuit card comprising means for the protection of the integrated circuit
US5822194A (en) * 1994-03-31 1998-10-13 Ibiden Co., Ltd. Electronic part mounting device
US6506626B1 (en) * 2000-05-12 2003-01-14 Siliconware Precision Industries Co., Ltd. Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same
WO2002034856A1 (en) 2000-10-27 2002-05-02 Seong Il Chemical Co., Ltd. Hot-melt adhesive for electronic components
KR20020032748A (en) 2000-10-27 2002-05-04 정하승 hot-melt adhesive for electronic components
US7038142B2 (en) * 2002-01-24 2006-05-02 Fujitsu Limited Circuit board and method for fabricating the same, and electronic device
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US20060171130A1 (en) * 2002-12-27 2006-08-03 Renesas Technology Corp. Semiconductor module
US20060139902A1 (en) * 2004-12-28 2006-06-29 Kabushiki Kaisha Toshiba Double-sided component-mounted circuit board and method for manufacturing the same
US20070044303A1 (en) * 2005-08-26 2007-03-01 Shinko Electric Industries Co., Ltd. Method of manufacturing wiring board
US20090107715A1 (en) * 2006-05-24 2009-04-30 Dai Nippon Printing Co. Ltd. Wiring board with a built-in component and method for manufacturing the same

Cited By (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9411751B2 (en) 2012-03-02 2016-08-09 Microsoft Technology Licensing, Llc Key formation
US9134807B2 (en) 2012-03-02 2015-09-15 Microsoft Technology Licensing, Llc Pressure sensitive key normalization
US8947864B2 (en) 2012-03-02 2015-02-03 Microsoft Corporation Flexible hinge and removable attachment
USRE48963E1 (en) 2012-03-02 2022-03-08 Microsoft Technology Licensing, Llc Connection device for computing devices
US10963087B2 (en) 2012-03-02 2021-03-30 Microsoft Technology Licensing, Llc Pressure sensitive keys
US9047207B2 (en) 2012-03-02 2015-06-02 Microsoft Technology Licensing, Llc Mobile device power state
US9064654B2 (en) * 2012-03-02 2015-06-23 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US9075566B2 (en) 2012-03-02 2015-07-07 Microsoft Technoogy Licensing, LLC Flexible hinge spine
US10013030B2 (en) 2012-03-02 2018-07-03 Microsoft Technology Licensing, Llc Multiple position input device cover
US9111703B2 (en) 2012-03-02 2015-08-18 Microsoft Technology Licensing, Llc Sensor stack venting
US9116550B2 (en) 2012-03-02 2015-08-25 Microsoft Technology Licensing, Llc Device kickstand
US9134808B2 (en) 2012-03-02 2015-09-15 Microsoft Technology Licensing, Llc Device kickstand
US20130227836A1 (en) * 2012-03-02 2013-09-05 David Otto Whitt, III Input device manufacture
US9146620B2 (en) 2012-03-02 2015-09-29 Microsoft Technology Licensing, Llc Input device assembly
US9158383B2 (en) 2012-03-02 2015-10-13 Microsoft Technology Licensing, Llc Force concentrator
US9158384B2 (en) 2012-03-02 2015-10-13 Microsoft Technology Licensing, Llc Flexible hinge protrusion attachment
US9176901B2 (en) 2012-03-02 2015-11-03 Microsoft Technology Licensing, Llc Flux fountain
US9176900B2 (en) 2012-03-02 2015-11-03 Microsoft Technology Licensing, Llc Flexible hinge and removable attachment
US9268373B2 (en) 2012-03-02 2016-02-23 Microsoft Technology Licensing, Llc Flexible hinge spine
US9275809B2 (en) 2012-03-02 2016-03-01 Microsoft Technology Licensing, Llc Device camera angle
US9298236B2 (en) 2012-03-02 2016-03-29 Microsoft Technology Licensing, Llc Multi-stage power adapter configured to provide a first power level upon initial connection of the power adapter to the host device and a second power level thereafter upon notification from the host device to the power adapter
US9360893B2 (en) 2012-03-02 2016-06-07 Microsoft Technology Licensing, Llc Input device writing surface
US9304948B2 (en) 2012-03-02 2016-04-05 Microsoft Technology Licensing, Llc Sensing user input at display area edge
US9304949B2 (en) 2012-03-02 2016-04-05 Microsoft Technology Licensing, Llc Sensing user input at display area edge
US9904327B2 (en) 2012-03-02 2018-02-27 Microsoft Technology Licensing, Llc Flexible hinge and removable attachment
US9946307B2 (en) 2012-03-02 2018-04-17 Microsoft Technology Licensing, Llc Classifying the intent of user input
US9870066B2 (en) 2012-03-02 2018-01-16 Microsoft Technology Licensing, Llc Method of manufacturing an input device
US9426905B2 (en) 2012-03-02 2016-08-23 Microsoft Technology Licensing, Llc Connection device for computing devices
US9852855B2 (en) 2012-03-02 2017-12-26 Microsoft Technology Licensing, Llc Pressure sensitive key normalization
US9460029B2 (en) 2012-03-02 2016-10-04 Microsoft Technology Licensing, Llc Pressure sensitive keys
US9465412B2 (en) 2012-03-02 2016-10-11 Microsoft Technology Licensing, Llc Input device layers and nesting
US9793073B2 (en) 2012-03-02 2017-10-17 Microsoft Technology Licensing, Llc Backlighting a fabric enclosure of a flexible cover
US9618977B2 (en) 2012-03-02 2017-04-11 Microsoft Technology Licensing, Llc Input device securing techniques
US9619071B2 (en) 2012-03-02 2017-04-11 Microsoft Technology Licensing, Llc Computing device and an apparatus having sensors configured for measuring spatial information indicative of a position of the computing devices
US9766663B2 (en) 2012-03-02 2017-09-19 Microsoft Technology Licensing, Llc Hinge for component attachment
US9678542B2 (en) 2012-03-02 2017-06-13 Microsoft Technology Licensing, Llc Multiple position input device cover
US9710093B2 (en) 2012-03-02 2017-07-18 Microsoft Technology Licensing, Llc Pressure sensitive key normalization
US8949477B2 (en) 2012-05-14 2015-02-03 Microsoft Technology Licensing, Llc Accessory device architecture
US9959241B2 (en) 2012-05-14 2018-05-01 Microsoft Technology Licensing, Llc System and method for accessory device architecture that passes via intermediate processor a descriptor when processing in a low power state
US9348605B2 (en) 2012-05-14 2016-05-24 Microsoft Technology Licensing, Llc System and method for accessory device architecture that passes human interface device (HID) data via intermediate processor
US10031556B2 (en) 2012-06-08 2018-07-24 Microsoft Technology Licensing, Llc User experience adaptation
US10107994B2 (en) 2012-06-12 2018-10-23 Microsoft Technology Licensing, Llc Wide field-of-view virtual image projector
US9073123B2 (en) 2012-06-13 2015-07-07 Microsoft Technology Licensing, Llc Housing vents
US9824808B2 (en) 2012-08-20 2017-11-21 Microsoft Technology Licensing, Llc Switchable magnetic lock
US9432070B2 (en) 2012-10-16 2016-08-30 Microsoft Technology Licensing, Llc Antenna placement
US9661770B2 (en) 2012-10-17 2017-05-23 Microsoft Technology Licensing, Llc Graphic formation via material ablation
US9027631B2 (en) 2012-10-17 2015-05-12 Microsoft Technology Licensing, Llc Metal alloy injection molding overflows
US8991473B2 (en) 2012-10-17 2015-03-31 Microsoft Technology Holding, LLC Metal alloy injection molding protrusions
US9304549B2 (en) 2013-03-28 2016-04-05 Microsoft Technology Licensing, Llc Hinge mechanism for rotatable component attachment
US10156889B2 (en) 2014-09-15 2018-12-18 Microsoft Technology Licensing, Llc Inductive peripheral retention device
TWI566652B (en) * 2015-09-16 2017-01-11 臻鼎科技股份有限公司 Circuit board and method for making the same field
US10101773B2 (en) 2016-04-08 2018-10-16 Microsoft Technology Licensing, Llc Non-woven material device covering

Also Published As

Publication number Publication date
US20090032292A1 (en) 2009-02-05
KR101354372B1 (en) 2014-01-23
KR20090012858A (en) 2009-02-04

Similar Documents

Publication Publication Date Title
US8059384B2 (en) Printed circuit board reinforcement structure and integrated circuit package using the same
CN111816082B (en) Display assembly and assembly method thereof, and display device
US8816212B2 (en) Flexible device and fabricating method thereof
US9036359B2 (en) Component built-in module, electronic device including same, and method for manufacturing component built-in module
US8252408B2 (en) Electronic device and method of manufacturing the electronic device
CN212322555U (en) Display assembly and display device
CN101140347A (en) Camera lens module and manufacturing method thereof
KR20140053563A (en) Laminated base meterial, substrate manufacturing method using the same, substrate
US20100155111A1 (en) Mounting structure
KR101943697B1 (en) Method for manufacturing semiconductor device, and semiconductor device
US20020014687A1 (en) Electronic part and manufacturing method therefor
CN114181641B (en) Composite adhesive tape and display device
US20080265432A1 (en) Multi-chip package and method of manufacturing the multi-chip package
US7705437B2 (en) Semiconductor device
WO2012005101A1 (en) Ic tag and production method for same
KR20140023820A (en) Pressure sensitive adhesive tape and method for producing substrate using the same
CN100454505C (en) Semiconductor device and method for fabricating the same
CN214587760U (en) Display panel and display device
JP2004007051A (en) Sealing member, and method for producing surface acoustic wave apparatus by using the same
JP5288476B2 (en) Substrate manufacturing method, circuit board, and electronic device
JP3817103B2 (en) Manufacturing method of display panel device
CN112760052B (en) Composite adhesive tape, processing method of composite adhesive tape and flexible screen module
CN212343815U (en) Side fingerprint identification subassembly and electronic equipment
CN111148396B (en) Frame-adding plate for electronic equipment and plastic forming method
CN113608636B (en) Display screen assembly and manufacturing method

Legal Events

Date Code Title Description
AS Assignment

Owner name: SAMSUNG ELECTRONICS CO., LTD., KOREA, REPUBLIC OF

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PARK, SE-HO;LEE, YOUNG-MIN;KIM, KI-HYUN;AND OTHERS;REEL/FRAME:021381/0552

Effective date: 20080718

STCF Information on status: patent grant

Free format text: PATENTED CASE

FEPP Fee payment procedure

Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

FPAY Fee payment

Year of fee payment: 4

FEPP Fee payment procedure

Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

LAPS Lapse for failure to pay maintenance fees

Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

STCH Information on status: patent discontinuation

Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362

FP Lapsed due to failure to pay maintenance fee

Effective date: 20191115