CN107636577B

CN107636577B - Capacitive display device

Info

Publication number: CN107636577B
Application number: CN201680027607.6A
Authority: CN
Inventors: M·K·海基宁; J·阿罗拉
Original assignee: Microsoft Technology Licensing LLC
Current assignee: Microsoft Technology Licensing LLC
Priority date: 2015-05-11
Filing date: 2016-04-15
Publication date: 2020-06-26
Anticipated expiration: 2036-04-15
Also published as: US20170235427A1; US20160334900A1; CN107636577A; WO2016182679A1; EP3295288A1; US10754478B2; US9671913B2; EP3295288B1

Abstract

An apparatus is described. In one example, a device includes a capacitive sensor layer and a conductive ground layer. A conductive ground layer is disposed below the capacitive sensor layer in a direction opposite to a target sensing direction of the device. The distance between the capacitive sensor layer and the conductive ground layer is configured to remain within a threshold value that exceeds the deformation range. In other examples, a method for manufacturing the device and module is discussed along with features of the device.

Description

Capacitive display device

Background

A gesture-sensitive panel is an input device that allows a user to input commands to a computing device by: the pointing content displayed on the screen of the image display device is selected by using his or her finger or other object or gesture. In this context, a gesture generally refers to a physical interaction between a human or object and a touch-sensitive panel. One example of a gesture is a touch on a touch sensitive panel. The sensors of the panel may be capacitive, configured to measure capacitance between the gesture and the electronics of the sensor.

SUMMARY

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

An apparatus is described. In one example, the device includes a capacitive sensor layer and a conductive ground layer. A conductive ground layer is disposed below the capacitive sensor layer in a direction opposite to a target sensing direction of the device. The distance between the capacitive sensor layer and the conductive ground layer is configured to remain within a threshold value across a range of deformation.

In other examples, methods for manufacturing the device and module are discussed along with features of the device.

Many of the attendant features will be more readily appreciated as the same becomes better understood by reference to the following detailed description considered in connection with the accompanying drawings.

Brief Description of Drawings

The specification will be better understood from a reading of the following detailed description in light of the accompanying drawings, in which:

FIG. 1 illustrates a cross-section of a schematic representation of a touch-sensitive display device in accordance with an illustrative example;

FIG. 2 illustrates a cross-section of a schematic representation of a structure including a touch-sensitive display device grounded by a conductor in accordance with an illustrative example;

FIG. 3 illustrates a cross-section of a schematic representation of a structure including a touch sensitive display device grounded through an Ag paste according to another illustrative example;

FIG. 4 illustrates a cross-section of a schematic representation of a structure including a touch-sensitive display device grounded through a sponge, according to another illustrative example;

FIG. 5 illustrates a cross-section of a schematic representation of a touch sensitive display having a ground layer at the bottom of the stack according to another illustrative example;

FIG. 6 illustrates a cross-section of a schematic representation of a structure having a touch-sensitive display device grounded by a conductive adhesive, according to another illustrative example;

FIG. 7 illustrates a cross-section of a schematic representation of a structure having a touch-sensitive display device grounded through a conductive sponge, according to another illustrative example;

FIG. 8 illustrates a cross-section of a schematic representation of a touch sensitive display having a ground layer over a TFT substrate according to another illustrative example; and

FIG. 9 illustrates a diagrammatical representation of a method for manufacturing a touch sensitive display in accordance with one example.

Like reference numerals are used to refer to like parts throughout the various drawings.

Detailed Description

The detailed description provided below in connection with the appended drawings is intended as a description of the present examples and is not intended to represent the only forms in which the present examples may be constructed or utilized. However, the same or equivalent functions and sequences may be accomplished by different examples.

FIG. 1 illustrates an example of a touch sensitive display 100. The display 100 may have a layered configuration in which multiple layers are stacked on top of each other to form a stack of layered elements. The display 100 may be configured to display an adjustable visual output to the exterior of the display 100. The display 100 may be a stand-alone, operable display, display module, or display panel to be integrated as part of a device, such as a mobile phone, smart phone, tablet computer, laptop computer, game controller, wearable electronic device, or the like.

The display 100 may include sub-elements used to generate text, graphics, and/or images to be displayed. Based on these layers, the display 100 may include various layers configured to form the displayed information. Control of the display 100 may be performed by various elements and components external to the display elements. Control signals and power may be provided to the display elements, for example, by appropriate wiring and cabling.

The display 100 may be based on any suitable electrical or electronic display technology, including for example LCD (liquid crystal display), OLED (organic light emitting diode) and AMOLED (active matrix organic light emitting diode), graphene based displays and any variants thereof.

The display 100 may be configured such that it may operate as a passive display element or portion thereof for presenting information only unidirectionally without any interaction. The display 100 may also be configured as an interactive display, such as may be operated by contacting or interacting with the display using a stylus. Touch sensitive display 100 may be configured as a gesture-based user interface, and it may be based on any suitable gesture or stylus capacitive sensing technology and variations thereof.

According to one example, the display 100 may be bendable or foldable. According to another example, the display 100 may be flexible. Errors in the touch sensitive display 100 caused by bending or distance variations of the main ground plane and the sensing layer of the device 100 below the display may be reduced. This error can be reduced by the conductive ground plane 102 and a capacitive sensitivity sensor such as the capacitive sensor 101. For example, the display device 100 may experience significant deformation, which may be generally greater in extent than the nominal deformation of any non-bendable or non-flexible material. By having a stable conductive ground layer 102, it is possible to reduce the sensitivity to errors and distance variations between the capacitive sensor 101 and the ground point.

The layers of the display 100 of fig. 1 are merely examples of possible elements. Touch sensitive display 100 may include any suitable number of elements, so long as each element includes at least one capacitive sensor 101 and at least one display element with respective ground layers 102.

The touch sensitive display 100 includes a stack of layers as illustrated in the example of FIG. 1. As illustrated in fig. 1, the layered elements of the display 100 are stacked in the sense that they are on top of each other, forming a stack of elements. These elements may also be referred to as layers. Each element or layer is formed as a generally sheet-like or plate-like structure having a width that is significantly greater than the thickness in a direction perpendicular to the defined width direction (i.e., in a "vertical" or "upright" direction). In practice, the width, or more generally the lateral dimension, may be for example in the range of a few centimetres to a few tens of centimetres, while the thickness of each element may be for example a few tens of micrometres. However, these numbers are merely exemplary, and the thickness of the display elements of the display 100 may vary.

The layers of touch sensitive display 100 may include cover glass 109, Optically Clear Adhesive (OCA) or Optically Clear Resin (OCR)108, polarizer 107, color filter substrate or package substrate 112, capacitive sensor 101, Thin Film Transistor (TFT) glass 104, TFT substrate 105, conductive ground layer 102, polarizer 106, and backlight 110. The touch sensitive display device also includes a portion of the main ground 111 of the device. The main ground 111 may be, for example, part of the frame of the device. The distance 103 between the capacitive sensor 101 and the ground plane 102 is illustrated in fig. 1. According to one example, the capacitive sensor 101 may be positioned on the TFT glass 104. According to another example, the capacitive sensor 101 may be positioned on another substrate, which is not necessarily a glass substrate, for example, on a package substrate or a color filter substrate.

In the example of fig. 1, conductive ground layer 102 may be disposed below capacitive sensor 101 and on an opposite side of capacitive sensor 101 relative to target sensing direction 130. For example, the conductive ground layer 102 may be disposed on the backside of the TFT substrate 105. Distance 103 between capacitive sensor 101 and conductive ground layer 102 may be stable. For example, distance 103 may remain substantially constant when capacitive sensor 101 and conductive ground layer 102 are used in a device. Distance 103 may remain stable, for example, when capacitive sensor 101 and conductive ground layer 102 are displaced. The layers comprising the capacitive sensor 101 and the conductive ground layer 102 may be displaced by an applied force in the target sensing direction 130. For example, a touch on the touch-sensitive display device 100 may displace layers. As another example, a force may be directed from below the touch sensitive display 100 by displacing the main ground 111 towards the sensing layer 102. In this case, the two

layers

101, 102 may be displaced simultaneously, such that the distance 103 remains substantially constant. Capacitive sensor 101 may have a capacitive connection via conductive grounded layer 102 rather than having a capacitive connection directly to the nearest grounded object (e.g., to a portion of main ground 111). For example, the sensitivity of the capacitive detection to errors caused by bending or distance variations between the sensor 101 and ground and other disturbances may thus be reduced. Furthermore, the variation of the distance of the capacitive sensor 101 with respect to the frame of the device and with respect to the conductive ground layer 102 can be reduced.

According to an example, the conductive ground layer 102 may be transparent, for example if it is arranged between the capacitive sensor 101 and the backlight 110 having illumination characteristics. The conductive ground layer 102 may be made of, for example, Indium Tin Oxide (ITO) which is a transparent and colorless conductive oxide.

For example, the capacitive sensor 101 may be a self-capacitive sensor or an in-cell capacitive sensor or a combination of these. Capacitive sensing is a technique based on capacitive coupling that can take the capacitance of the human body as an input. Capacitive sensors can detect a variety of things that are conductive or have a dielectric different from air. Many types of sensors use capacitive sensing, including sensors used to detect and measure proximity, position, or displacement. A human interface device based on capacitive sensing, such as a trackpad, may for example replace a computer mouse. The device may also use a capacitive sensing touch screen as an input device. Capacitive sensors may further replace mechanical buttons.

According to one example, the self-capacitance sensor may be based on an X-Y matrix of micro-capacitors (micro-fine capacitors) embedded within, for example, a laminated glass substrate. Using self-capacitance, the capacitive loading of the finger on each column or row of the matrix can be detected. Which can use frequency modulation to detect small capacitance changes within the conductive traces.

According to one example, using in-cell capacitive sensor technology, some layers may be eliminated by building capacitors inside the display 100 itself. For example, in-cell electrodes may be deposited on a glass layer inside the LCD panel. A digitizer can be used for touch sensitivity while an LCD screen displays the image on the screen. in-cell capacitive sensor display technology combines these layers into a single layer, allowing for thinner and lighter devices.

Fig. 2-4 illustrate an example in which a conductive ground layer 102 is disposed below the TFT substrate 105 and the layer 102 is electrically connected to the main ground 111 of the display device. This can be achieved in several ways, for example using a cover layer opening as illustrated in the example of fig. 2, a conductive paste as illustrated in the example of fig. 3, and a conductive sponge as illustrated in the example of fig. 4.

Fig. 2 illustrates an example of a structure configured to electrically connect conductive grounded layer 102 to main ground 111. In the example of fig. 2, conductive ground layer 102 is connected to flexible printed circuit conductor 116 via conductive adhesive layer 115. The flexible printed circuit conductors 116 may be connected to the LEDs 117. The conductive adhesive is attached to the cover opening on the conductor 116. The flexible printed circuit conductor 116 includes a power-on connection 118 that is made, for example, by soldering the flexible printed circuit conductor 116 to the main flexible printed circuit conductor 114. Main conductor 114 is connected to main ground 111. Thus, conductive ground layer 102 is electrically connected and grounded to main ground 111.

Fig. 3 illustrates another example of a structure configured to electrically connect conductive grounded layer 102 to main ground 111. In the example of fig. 3, the main flexible printed circuit conductor 114 is connected to the main ground 111. Conductive paste 119 connects conductive ground layer 102 to main flexible printed circuit conductor 114. For example, Ag paste may be used to connect the layer 102 to the conductor 114. Thus, conductive ground layer 102 is electrically connected and grounded to main ground 111.

Fig. 4 illustrates another example of a structure configured to electrically connect conductive grounded layer 102 to main ground 111. In the example of fig. 4, conductive ground layer 102 is connected to main flexible printed circuit conductor 114 through a conductive sponge 120. A conductive sponge 120 may be connected to the opening of the covering of the conductor 114. Thus, ground layer 102 is electrically connected to main ground 111.

The conductive ground layer 102 may be arranged further than illustrated in the example of fig. 1, for example on the back side of the display 100, as illustrated in fig. 5. FIG. 5 illustrates another example of a touch sensitive display 100. In the example of fig. 5, a conductive ground plane 102 is configured on the back side of the display 100. For example, conductive ground layer 102 may be disposed below backlight 110. The distance 103 between the capacitive sensor 101 and the ground plane 102 is illustrated in fig. 5. Although there are more layers between capacitive sensor 101 and conductive ground layer 102 than in the example of fig. 1, distance 103 remains stable when capacitive sensor 102 and conductive ground layer 102 are displaced. The distance 103 thus remains stable while the touch sensitive display 100 and corresponding device are being used. The distance 103 is configured to be substantially constant. The two

layers

101, 102 may be displaced simultaneously along with all layers of the display 100, whereby the distance 103 remains stable and constant. Capacitive sensor 101 may have a capacitive connection via conductive grounded layer 102 rather than having a capacitive connection directly to main ground 111.

According to one example, conductive ground layer 102 may be opaque if it is disposed under backlight 110 or if the display system is an Organic Light Emitting Diode (OLED).

Fig. 6 and 7 illustrate an example in which a conductive grounded layer 102 is disposed below a backlight 110 and the layer 102 is galvanically connected to the device's main ground 111. There may be several examples for this, for example using a conductive tape as illustrated in fig. 6 or a conductive sponge as illustrated in fig. 7. According to another example, the layer below the backlight 110 may also be a conductive sponge type and may be directly connected to the main ground 111.

Fig. 6 illustrates an example of a structure in which the conductive ground layer 102 is electrically connected to the main ground 111. Conductive ground layer 102 is situated under backlight 110. Conductive adhesive layer 121 connects conductive ground layer 102 to main flexible printed circuit conductor 114. Conductive adhesive layer 121 may underlie ground layer 102 and conductor 114. Conductor 114 is connected to main ground 111 and thus ground layer 102 is galvanically connected to main ground 111.

Fig. 7 illustrates an example of a structure in which the conductive ground layer 102 is electrically connected to the main ground 111. In the example of fig. 7, conductive ground layer 102 is situated below backlight 110. Conductive sponge 122 connects ground plane 102 to main ground 111. The main flexible printed circuit conductor 114 is shown in the example of fig. 7; however, it is not required by the live ground in this example, as the ground layer 102 is connected to the main ground 111 by direct means between it and the main ground 111.

FIG. 8 illustrates another example of a touch sensitive display 100. In the example of fig. 8, a conductive ground layer 102 is disposed above the TFT substrate 105. An intermediate layer 123 may be disposed between conductive ground layer 102 and capacitive sensor 101. For example, a TFT glass layer 104 may be fabricated between the layer 102 and the sensor 101.

FIG. 9 illustrates an example of a method for manufacturing a touch sensitive display 100. The display may be similar to any of the examples of displays discussed above. The method examples may also be performed in an optional step or order as described below. In step 123, the capacitive sensor layer 101 is disposed between layers of the display 100 of the device. For example, the capacitive sensor 101 may be disposed above the TFT substrate 105 and below the CF substrate 112. In step 124, the conductive ground element layer 102 is disposed under the capacitive sensor layer 101 in a direction opposite to a target sensing direction of the touch sensitive display device. For example, the ground layer 102 may be disposed below the TFT substrate 105, and may even be farther below the backlight 110. In step 125, the distance between the capacitive sensor layer 101 and the conductive ground element layer 102 is configured to be stable. This distance remains constant when the device is used or when the layers are displaced. According to one example, the display 100 may be integrated into a device. According to another example, the display 100 may interoperate with a device. In this case, the device may not require specific interoperability software algorithms because the display 100 may interoperate with the device after the manufacturing process.

Although examples have been discussed in the form of a device such as a smart phone as discussed, other bendable and non-bendable computing devices may be equally used, such as a tablet computer, a netbook computer, a laptop computer, a desktop computer, a processor-enabled television, a Personal Digital Assistant (PDA), a touch screen device connected to a video game controller or set-top box, or any other computing device having a gesture-sensitive display unit and enabled to apply it.

The terms "computer," "computing-based device," "device," or "mobile device" as used herein refer to any device with processing capability such that instructions may be executed. Those skilled in the art will appreciate that such processing capabilities are incorporated into many different devices, and thus the terms "computer" and "computing-based device" each include personal computers, servers, mobile phones (including smart phones), tablet computers, set-top boxes, media players, game consoles, personal digital assistants, and many other devices.

The manufacturing methods and functions described herein may be operated by software in machine-readable form on a tangible storage medium, for example in the form of a computer program comprising computer program code means adapted to perform all the steps of any of the methods and functions described herein when the program is run on a computer and wherein the computer program may be included on a computer-readable medium. Examples of tangible storage media include computer storage devices that include computer readable media such as disks, thumb drives, memory, and the like, without the propagated signals. A propagated signal may be present in a tangible storage medium, but a propagated signal is not an example of a tangible storage medium per se. The software may be adapted to be executed on a parallel processor or a serial processor such that the method steps may be performed in any suitable order, or simultaneously.

This acknowledges that software can be a valuable, individually exchangeable commodity. It is intended to encompass software running on or controlling "dumb" or standard hardware to carry out the required functions. It is also intended to encompass software which "describes" or defines the configuration of hardware, such as HDL (hardware description language) software used to design silicon chips, or to configure general purpose programmable chips, to carry out desired functions.

Those skilled in the art will realize that storage devices utilized to store program instructions may be distributed across a network. For example, the remote computer may store an example of the process described as software. A local or terminal computer may access the remote computer and download a part or all of the software to run the program. Alternatively, the local computer may download pieces of the software, as needed, or execute some software instructions at the local terminal and other software instructions at the remote computer (or computer network). Alternatively or additionally, the functions described herein may be performed, at least in part, by one or more hardware logic components. By way of example, and not limitation, illustrative types of hardware logic components that may be used include Field Programmable Gate Arrays (FPGAs), Application Specific Integrated Circuits (ASICs), Application Specific Standard Products (ASSPs), systems on a chip (SOCs), Complex Programmable Logic Devices (CPLDs), and the like.

Any range or device value given herein may be extended or altered without losing the effect sought. Any example may also be combined into another example unless explicitly allowed.

Although the subject matter has been described in language specific to structural features and/or acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as examples of implementing the claims, and other equivalent features and acts are intended to be within the scope of the claims.

It will be appreciated that the benefits and advantages described above may relate to one example or may relate to several examples. The examples are not limited to only those embodiments that solve any or all of the stated problems or those embodiments that have any or all of the stated advantages. It will further be understood that reference to "an" item refers to one or more of those items.

The steps of the methods described herein may be performed in any suitable order, or simultaneously, where appropriate. In addition, individual blocks may be deleted from any of the methods without departing from the spirit and scope of the subject matter described herein. Aspects of any of the examples described above may be combined with aspects of any of the other examples described to form further examples without losing the effect sought.

The term "comprising" is used herein to mean including the identified blocks or elements of a method, but such blocks or elements do not include an exclusive list and a method or apparatus may include additional blocks or elements.

In light of the foregoing, some examples relate to an apparatus comprising: a capacitive sensor layer; and a conductive ground layer, wherein the conductive ground layer is disposed below the capacitive sensor layer in a direction opposite to a target sensing direction of the device; wherein a distance between the capacitive sensor layer and the conductive ground layer is configured to remain within a threshold value that exceeds a range of deformation. Additionally or alternatively to one or more examples, the distance is configured to be stable when at least one of the layers is displaced or bent. Additionally or alternatively to one or more examples, the distance is configured to be constant when the two layers are displaced. Additionally or alternatively to one or more examples, a display comprising two or more layers is included, wherein the capacitive sensor layer is configured between layers of the display. Additionally or alternatively to one or more examples, the device includes a touch-sensitive display device, and at least one of the layers is displaced by a touch on the touch-sensitive display device, wherein the touch is directed in a target sensing direction. Additionally or alternatively to one or more examples, the device includes a bendable touch-sensitive display device. Additionally or alternatively to one or more examples, the capacitive sensor layer is configured to capacitively detect a touch on a surface of the device. Additionally or alternatively to one or more examples, the capacitive sensor layer includes a self-capacitive sensor layer or an absolute capacitive sensing layer. Additionally or alternatively to one or more examples, the capacitive sensor layer includes an in-cell capacitive sensor layer. Additionally or alternatively to one or more examples, the conductive ground layer is galvanically connected to a main ground of the device. Additionally or alternatively to one or more examples, the conductive ground layer is disposed below the thin film transistor, TFT, layer and the capacitive sensor layer is disposed above the TFT layer. Additionally or alternatively to one or more examples, the conductive ground layer is disposed above a backlight of the display device. Additionally or alternatively to one or more examples, the conductive ground layer is transparent. Additionally or alternatively to one or more examples, further comprising: a first flexible conductor connected to a main ground of the device; and a second flexible conductor connected to the conductive ground layer and the first flexible conductor, wherein the second flexible conductor is connected to the conductive ground layer through the conductive adhesive layer. Additionally or alternatively to one or more examples, further comprising a flexible conductor connected to a main ground of the device, wherein the conductive ground layer is connected to the flexible connector by a conductive paste, by a conductive sponge, or by a conductive adhesive. Additionally or alternatively to one or more examples, the conductive ground layer is disposed below a backlight of the device. Additionally or alternatively to one or more examples, the conductive ground layer is opaque. Additionally or alternatively to one or more examples, the conductive ground layer is directly connected to a main ground of the device through a conductive sponge.

Some examples relate to a method for manufacturing an apparatus, comprising: disposing a capacitive sensor layer between layers of a display of a device; and disposing a conductive ground element layer below the capacitive sensor layer in a direction opposite to a target sensing direction of the device; wherein a distance between the capacitive sensor layer and the conductive ground element layer is configured to remain within a threshold value that exceeds a range of deformation.

Some examples are directed to a touch-sensitive display module, comprising: a capacitive sensor element; and a conductive ground element, wherein the conductive ground element is disposed below the capacitive sensor element in a direction opposite to a target sensing direction of the touch sensitive display module; wherein the distance between the capacitive sensor element and the conductive ground element is configured to be substantially constant.

It will be understood that the above description is given by way of example only and that various modifications may be made by those skilled in the art. The above specification, examples and data provide a complete description of the structure and use of exemplary embodiments. Although examples have been described above with a certain degree of particularity, or with reference to one or more individual examples, those skilled in the art could make numerous alterations to the disclosed examples without departing from the spirit or scope of this specification.

Claims

1. An apparatus for display, comprising:

a capacitive sensor layer; and

a conductive ground layer, wherein the conductive ground layer is disposed below the capacitive sensor layer in a direction opposite a target sensing direction of the device;

a first flexible conductor connected to a main ground of the device; and

a second flexible conductor connected to the conductive grounded layer and the first flexible conductor, wherein the second flexible conductor is connected to the conductive grounded layer by a conductive adhesive layer;

wherein a distance between the capacitive sensor layer and the conductive ground layer is configured to remain within a threshold value that exceeds a range of deformation.

2. The device of claim 1, wherein the distance is configured to be stable when at least one of the layers is displaced or bent.

3. The device of claim 1, wherein the distance is configured to be constant when two layers are displaced.

4. The device of claim 1, comprising a display comprising two or more layers, wherein the capacitive sensor layer is configured between the layers of the display.

5. The device of claim 1, wherein the device comprises a touch sensitive display device, and wherein at least one of the layers is displaced by a touch on the touch sensitive display device, wherein the touch is directed in the target sensing direction.

6. The device of claim 1, wherein the device comprises a bendable touch sensitive display device.

7. The device of claim 1, wherein the capacitive sensor layer is configured to capacitively detect a touch on the device surface.

8. The device of claim 1, wherein the capacitive sensor layer comprises a self-capacitive sensor layer or an absolute capacitive sensing layer.

9. The apparatus of claim 1, wherein the capacitive sensor layer comprises an in-cell capacitive sensor layer.

10. The device of claim 1, wherein the conductive ground layer is galvanically connected to a main ground of the device.

11. The device of claim 1, wherein the conductive ground layer is disposed below a Thin Film Transistor (TFT) layer and the capacitive sensor layer is disposed above the TFT layer.

12. The device of claim 1, wherein the conductive ground layer is disposed above a backlight of the device.

13. The apparatus of claim 12, wherein the conductive ground layer is transparent.

14. The device of claim 1, further comprising a flexible conductor connected to a main ground of the device, wherein the conductive ground layer is connected to a flexible connector by a conductive paste, by a conductive sponge, or by a conductive adhesive.

15. The device of claim 1, wherein the conductive ground layer is disposed below a backlight of the device.

16. The apparatus of claim 15, wherein the conductive ground layer is opaque.

17. The apparatus of claim 15, wherein the conductive ground layer is directly connected to a main ground of the apparatus through a conductive sponge.

18. A method for manufacturing a device, comprising:

disposing a capacitive sensor layer between layers of a display of the device; and

disposing a conductive ground element layer below the capacitive sensor layer in a direction opposite a target sensing direction of the device;

connecting the first flexible conductor to a main ground; and

connecting a second flexible conductor to the conductive ground element layer and the first flexible conductor, wherein the second flexible conductor is connected to the conductive ground element layer by a conductive adhesive layer;

wherein a distance between the capacitive sensor layer and the conductive ground element layer is configured to remain within a threshold value that exceeds a range of deformation.

19. A touch-sensitive display module comprising:

a capacitive sensor element; and

a conductive ground element, wherein the conductive ground element is disposed below the capacitive sensor element in a direction opposite a target sensing direction of the touch-sensitive display module;

a first flexible conductor connected to a main ground; and

a second flexible conductor connected to a conductive ground element layer and the first flexible conductor, wherein the second flexible conductor is connected to the conductive ground element layer by a conductive adhesive layer;

wherein a distance between the capacitive sensor element and the conductive ground element is configured to be substantially constant.